Some novel applications of sputtering technique for diffusion studies in solidsGUPTA, Devendra.Zeitschrift für Metallkunde. 2004, Vol 95, Num 10, pp 928-938, issn 0044-3093, 11 p.Article

Coefficient de pulvérisation des métaux par les ionsBABAEV, V. P; ZABOLOTNYJ, V. T; IVANOV, L. I et al.Fizika i himiâ obrabotki materialov. 1985, Num 5, pp 3-5, issn 0015-3214Article

Chrome coatings with the aid of magnetrone ione powder coatingTODOROVA, S; DOCHEV, D; KYNEV, M et al.1985, Vol 34, Num 11, pp 505-507, issn 0025-455XArticle

An Alternative Solution for Sputtering Targets for High-Volume Thin-Film DepositionVILLAFUERTE, Julio; WRIGHT, David.Welding journal. 2010, Vol 89, Num 9, pp 28-30, issn 0043-2296, 3 p.Article

Electric probe measurements in pulsed magnetron plasmasBRADLEY, J. W; KARKARI, S; VETUSHKA, A et al.Surface engineering. 2004, Vol 20, Num 3, pp 186-188, issn 0267-0844, 3 p.Conference Paper

Recent advances in sputter deposition = Progrès récents dans le dépôt par pulvérisationTHORNTON, J. A.Surface engineering. 1986, Vol 2, Num 4, pp 283-292, issn 0267-0844Article

Structure and polarization properties of Zn-Nb films formed on steel sheet by sputteringKUBOYAMA, Hiroshi; NAKANO, Hiroaki; OUE, Satoshi et al.ISIJ international. 2006, Vol 46, Num 8, pp 1205-1209, issn 0915-1559, 5 p.Article

Pulsed plasmas for sputtering applicationsSPROUL, W. D; CHRISTIE, D. J; CARTER, D. C et al.Surface engineering. 2004, Vol 20, Num 3, pp 174-176, issn 0267-0844, 3 p.Conference Paper

Quantitative predictions of sputtering phenomena = Prévisions quantitatives des phénomènes de pulvérisationECKSTEIN, W.Surface and interface analysis. 1989, Vol 14, Num 12, pp 799-808, issn 0142-2421Article

Properties of NiO sputtered thin films and modeling of their sensing mechanism under formaldehyde atmospheresCASTRO-HURTADO, I; MALAGU, C; MORANDI, S et al.Acta materialia. 2013, Vol 61, Num 4, pp 1146-1153, issn 1359-6454, 8 p.Article

Structural Characterization of Sputter-Deposited 304 Stainless Steel+10 wt pct Al CoatingsRAO SEELAM, Uma Maheswara; SURYANARAYANA, C; HEINRICH, Helge et al.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2012, Vol 43, Num 8, pp 2945-2954, issn 1073-5623, 10 p.Article

Hydrogen behavior in nanocrystalline titanium thin filmsTAL-GUTELMACHER, E; GEMMA, R; PUNDT, A et al.Acta materialia. 2010, Vol 58, Num 8, pp 3042-3049, issn 1359-6454, 8 p.Article

Metallisierung von Formteilen in einer Kurztakt-Anlage = Metallizing moulded parts in a short cycle plantKUKLA, R; HOFMANN, D; ICKES, G et al.Metalloberfläche. 1994, Vol 48, Num 6, pp 410-413, issn 0026-0797Article

Sputtering induced topography development on f.c.c. metals = Entwicklung der Topographie durch Sputtern bei kfz MetallenCARTER, G; NOBES, M.J; WHITTON, J.L et al.Applied physics. A, Solids and surfaces. 1985, Vol A38, Num 2, pp 77-95, issn 0721-7250Article

Multiferroic properties and magnetoelectric coupling in highly textured Pb(Fe_0.5Nb_0.5)O₃ thin films obtained by RF sputteringRAYMOND, Oscar; OSTOS, Carlos; FONT, Reynaldo et al.Acta materialia. 2014, Vol 66, pp 184-191, issn 1359-6454, 8 p.Article

Preparation and some properties of sputtered Co/U-As multilayersPLASKETT, T. S; FUMAGALLI, P; MCGUIRE, T. R et al.IEEE transactions on magnetics. 1992, Vol 28, Num 5, pp 2659-2661, issn 0018-9464, 2Conference Paper

Growth and disintegration of cones on silver surface under high fluence Xe atom bombardment = Croissance et désintégration de cônes sur une surface d'argent sous bombardement d'atomes de Xe de haute fluenceNINDI, M; STULIK, D.Radiation effects. 1988, Vol 106, Num 1-2, pp 99-106, issn 0033-7579Article

The application of a new 3S method to sputtering velocity and yield measurements = Application de la nouvelle méthode «3S» aux mesures de la vitesse et du rendement de pulvérisationKOWALSKI, Z. W.Journal of materials science letters. 1987, Vol 6, Num 10, pp 1207-1208, issn 0261-8028Article

Diffusion in molybdenum disilicideSALAMON, Marcel; MEHRER, Helmut.Zeitschrift für Metallkunde. 2005, Vol 96, Num 8, pp 833-842, issn 0044-3093, 10 p.Article

Industrial application of pulsed DC bias power supplies in closed field unbalanced magnetron sputter ion platingCOOKE, K. E; HAMPSHIRE, J; SOUTHALL, W et al.Surface engineering. 2004, Vol 20, Num 3, pp 189-195, issn 0267-0844, 7 p.Conference Paper

Microstructure and magnetic properties for highly coercive FePt sputtered films : L10-type ultra-high density magnetic recording materialsSHIMA, Toshiyuki; TAKANASHI, Koki; LI, Guo Qing et al.Materials transactions - JIM. 2003, Vol 44, Num 8, pp 1508-1513, issn 0916-1821, 6 p.Article

Some recent applications of materials deposited by unbalanced magnetron sputteringKELLY, P. J; ARNELL, R. D; AHMED, W et al.Surface engineering. 1993, Vol 9, Num 4, pp 287-291, issn 0267-0844Article

Calcul analytique de la distribution des défauts d'irradiation et d'une impureté aux doses limites d'implantation d'ionsKURGANOV, A. G; FAL'KO, G. L; FEDORCHENKO, A. M et al.Fizika metallov i metallovedenie. 1986, Vol 61, Num 1, pp 16-20, issn 0015-3230Article

Recent progress in multi-element alloy and nitride coatings sputtered from high-entropy alloy targetsCHENG, Keng-Hao; LAI, Chia-Han; LIN, Su-Jien et al.Annales de chimie (Paris. 1914). 2006, Vol 31, Num 6, pp 723-736, issn 0151-9107, 14 p.Article

Electronic and luminescence properties of sputter-deposited TiO₂ nanostructuresCHANG, Yu-Ming; MISHRA, Dillip K; TING, Jyh-Ming et al.Acta materialia. 2013, Vol 61, Num 19, pp 7511-7519, issn 1359-6454, 9 p.Article